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BRIGHT LED ELECTRONICS CORP. SINCE 1981 DATA SHEET DEVICE NUMBERBL-HZP39M-TRB SHEET DATE 2004.12.28 2005.01.13 1 2 3 4 5 6 7 8 CONTENTS Preliminary Add VF BIN; Tapping Q'ty 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.1 1.1 1.1 BRIGHT LED ELECTRONICS CORP. 19 3 3F., No. 19, Ho Ping Road, Pan Chiao City, Taipei, Taiwan, R. O. C. Tel: 886-2-29591090 Fax: 886-2-29547006/29558809 www.brtled.com. APPROVED DRAWER 2005.01.13 2005.01.13 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZP39M-TRB Features: 1. Emitted Color : White 2. Mono-color type. 3. Suitable for all SMT assembly methods. 4. Compatible with infrared and vapor phase reflow solder process. 5. Compatible with automatic placement equipment. 6. This product doesn't contain restriction Substance, comply ROHS standard. 7. ESD6000V. P1.P2 4.4 Package Dimensions: CATHODE MARK 4- 0.95 0 Applications: 1. 2. 3. Flash light . Backlighting : LCDs. Status indicators : Comsumer & industrial electronics. P3.P4 NOTES: 1.All dimensions are in millimeters. 2.Tolerance is 0.10mm unless otherwise specified. 3.Specifications are subject to change without notice. 4. General use. Absolute Maximum Ratings(Ta=25) Parameter Power Dissipation Forward Current Peak Forward Current 1 Electro-static Discharge Operating Temperature Storage Temperature Soldering Temperature Symbol Pd IF IFP ESD Topr Tstg Tsol Rating 600 150 500 6000 -25~80 -30~85 See Page5 Unit mW mA mA V - 1 Condition for IFP is pulse of 1/10 duty and 30msec width. Note: The values are based on 1-die performance. Ver.1.0 Page 1 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZP39M-TRB Electrical and optical characteristics(Ta=25) Parameter Forward Voltage Luminous Intensity Veiwing Angle Chromaticity Coordinates Symbol VF Iv 21/2 x y Condition IPF=350mA IPF=350mA IPF=350mA IPF=350mA Min. 3.2 15 0.26 0.26 Typ. 3.8 60 0.30 0.30 Max. 4.2 0.32 0.32 Unit V cd deg - IPF: test time=100ms. Typical Electro-Optical Characteristics Curves Fig.1 IF-VF Characteristics 2000 1000 4.0 Fig.2 VF-Ta Characteristics 500 3.8 3.6 IPF=350mA IF (mA) VF(v) 3.0 3.5 4.0 4.5 5.0 100 3.4 3.2 50 3.0 10 2.5 -20 0 20 40 60 80 100 VF (V) Ta( C ) Fig.3 IV-IF Characteristics 10 200 Fig.4 IV-Ta Characteristics 5 100 Relative IV. 1.0 IV (%) 50 0.5 0.1 50 100 500 1000 5000 20 -20 0 20 40 60 80 100 IF(mA) Ta( C) Fig.5 Max-Ta Characteristics 300 Fig.6 Radiation diagram 0 10 20 30 250 RELATIVE RADIANT INTENSITY 200 40 1.0 0.9 0.8 50 60 70 0.7 80 90 0.5 0.3 0.1 0.2 0.4 0.6 IF (mA) 150 100 50 0 -20 0 20 40 Ta( C) 60 80 100 Ver.1.1 Page 2 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZP39M-TRB Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 1.7 0.1 START 17.2 1.2 5.3 END 13.0 0.5 TRAILER LEADER FIXING TAPE 71.0 1 1.75 0.1 5.5 0.05 12.0 0.3 4.0 0.1 4.0 0.1 1.5 0.1 2.0 0.05 0.3 NOTE: 1500 pcs PER REEL Package Method:(unit:mm) 12 bag/box 1500 pcs/reel 215 Bar Code Label 245 230 167 220 Aluminum Foil Bag 645 6 box/carton 230 334 Ver.1.1 Page 3 of 8 179 1 5.3 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZP39M-TRB Bin Limits Intensity Bin Limits (@ IPF=350mA) BIN CODE Min. (cd) ZB 15 Max. (cd) - VF Bin Limits (@ IPF=350mA) BIN CODE J K L M N Min.(V) 3.2 3.4 3.6 3.8 4.0 Max.(V) 3.4 3.6 3.8 4.0 4.2 B IN x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver1.1 Page 4 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZP39M-TRB Color Bin Limits (IPF=350mA) Chromaticity Coordinates y x IN F-1 F-2 F-3 F-4 F-5 F-6 F-7 x y x y x y x y x y x y x y 0.28 0.26 0.28 0.28 0.30 0.26 0.30 0.28 0.30 0.30 0.32 0.28 0.32 0.30 Chromaticity Coordinates 0.26 0.26 0.26 0.28 0.28 0.26 0.28 0.28 0.28 0.30 0.30 0.28 0.30 0.30 0.26 0.28 0.26 0.30 0.28 0.28 0.28 0.30 0.28 0.32 0.30 0.30 0.30 0.32 0.28 0.28 0.28 0.30 0.30 0.28 0.30 0.30 0.30 0.32 0.32 0.30 0.32 0.32 Ver.1.0 Page 5 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZP39M-TRB Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-12 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Connect with a power If=100mA Ta=Under room temperature Test time=1,000hrs Ta=+655 RH=90%-95% Test time=240hrs High Ta=+855 Test time=1,000hrs Low Ta=-355 Test time=1,000hrs -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min Test Time=5cycle -355 ~+855 20min 20min Test Time=10cycle Preheating 140-160,within 2 minutes. Operation heating 235(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 0/20 0/20 0/20 0/20 Judgment criteria of failure for the reliability Measuring items Forward voltage Luminous intensity Symbol VF ( V) Iv (cd ) Measuring conditions IPF=350mA IPF=350mA Judgement criteria for failure Over Ux1.2 Below SX0.5 Note: 1.U means the upper limit of specified characteristics. S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver1.0 Page 6 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZP39M-TRB Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300(572) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140~1605,within 2 minutes. Operation heating : 260(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. 3. DIP soldering (Wave Soldering) : Preheating : 120~150,within 120~180 sec. Operation heating : 245 5 within 5 sec.260 (Max) Gradual Cooling (Avoid quenching). Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Temperature 140~160 260 MAX. 4 /SEC. MAX. 4 /SEC. MAX. OVER 2 MIN. Time Soldering heat Max. 260 120~150 245 5 within 5 sec. Temperature Preheat 120~180 sec. Time Ver.1.0 Page 7 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZP39M-TRB Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5-30(41)Humidity : RH 60Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 603. Package and Label of Products: (1) Package: Products are packed in one bag of 1500 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx Year xx Month xx Day Manufacture Location Ver1.1 Page 8 of 8 |
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